| 摘要 |
1. A process for the seamless bonding of hollow thermoplastic profiles (1, 2) by plasticiging the ends of the profiles which are to be bonded an which are clamped abuttingly, using an outer mould (4) which completely surrounds the ends and a supporting device (3) which is slidable in the interior of the hollow profiles (1, 2), characterized in that the ends, which are to be bonded and are clamped abuttingly, of the hollow profiles (1, 2) are plasticized by means of an outer mould (4) which can be heated and be split, and at the same time a supporting device (3) whose volume can be changed and which is kept under excess pressure is introduced, the said device resting smoothly against the inner wall of the hollow profiles (1, 2). |
