Apparatus and process for the manufacture of electronic components

摘要

In an apparatus and process for transport and support of electronic components, the leads of the components are mounted transversely and parallel to each other on a support strip adapted for being moved in a longitudinal direction. The leads are mounted so that they are parallel to each other and equidistant and held firmly in position by adhesive tape of specified thickness in relation to the thickness of the support strip. The leads protrude from at least one edge of the support strip to facilitate attachment of electronic components. Positive positioning of the leads at accurately spaced distances is achieved.