发明名称 |
ELECTROPLATING APPARATUS |
摘要 |
<p>Electroplating apparatus for applying a protective metallic coating on the surface of an object has chamber means which includes a process chamber containing at least a part of the liquid electrolyte solution and in which the object to be seated is submerged. Atmospheric air is prevented from flowing through the process chamber, and a pneumatic pressure-reducing pump is connected to the chamber means to maintain a reduced pressure, which is substantially below atmospheric, above the electrolyte solution within at least a part of the chamber means.</p> |
申请公布号 |
CA1093012(A) |
申请公布日期 |
1981.01.06 |
申请号 |
CA19760251918 |
申请日期 |
1976.05.06 |
申请人 |
ANDERSSON, LARS E.;KORPI, TEUVO T.;KURSI, KAUKO J.;NIEMI, UUNO M. |
发明人 |
KORPI, TEUVO T. |
分类号 |
C25D5/00;C25D17/00;C25D21/00;C25D21/04;(IPC1-7):25D17/00 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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