发明名称 ELECTROPLATING APPARATUS
摘要 <p>Electroplating apparatus for applying a protective metallic coating on the surface of an object has chamber means which includes a process chamber containing at least a part of the liquid electrolyte solution and in which the object to be seated is submerged. Atmospheric air is prevented from flowing through the process chamber, and a pneumatic pressure-reducing pump is connected to the chamber means to maintain a reduced pressure, which is substantially below atmospheric, above the electrolyte solution within at least a part of the chamber means.</p>
申请公布号 CA1093012(A) 申请公布日期 1981.01.06
申请号 CA19760251918 申请日期 1976.05.06
申请人 ANDERSSON, LARS E.;KORPI, TEUVO T.;KURSI, KAUKO J.;NIEMI, UUNO M. 发明人 KORPI, TEUVO T.
分类号 C25D5/00;C25D17/00;C25D21/00;C25D21/04;(IPC1-7):25D17/00 主分类号 C25D5/00
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