| 摘要 |
<p>PURPOSE:To form a solder pad layer up to the lead ends without fail by a method wherein a resin as a molding material is held in a recess by forming the resin trapping recess in a dam to prevent the resin from running out to the lead ends to be set and bonded thereto. CONSTITUTION:A resin sealed package is formed using multiple lead frames 1 connected to a dam 3 of a unit lead frame 2. At this time, resin trapping recesses 8 are formed in the dam 3. When the resin as a molding material runs out along the surface of dams 3 in case of transfer molding of the resin sealed package, the resin is held in the recesses 8 so that the resin may be prevented from running out to the lead ends to be set and bonded thereto. Through these procedures, a solder pad layer can be formed up to the lead ends without fail.</p> |
