发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To effect convenient application of a sputtering apparatus to experimental research with reduced cost by a construction wherein the rotary shafts of a vacuum chamber containing substrate and cathode are so arranged as to allow the cathode to be located in any of vertical and horizontal positions in relative to the substrate. CONSTITUTION:A vacuum chamber 1 containing a substrate 5 and a cathode 8 is supported by a support frame 4 so that the chamber 1 can be freely rotated by rotary shafts 2, 3. The substrate 5 is mounted at the center section of the chamber 1 by means of a supporting part 6 passing through the rotary shaft 2. A target 7 is mounted to the cathode 8. An exhaust duct is connected through the rotary shaft 3 to an exhaust pump 9. All these constitute a sputtering apparatus. As a result, the rotation of the vacuum chamber 1 allows the relative position of the substrate 5 and the target 7 to take any position in vertical and horizontal directions. Thus, in experiments and researches, the time and cost for changing the operating positions is drastically reduced as compared with conventional method.
申请公布号 JPS56276(A) 申请公布日期 1981.01.06
申请号 JP19790075597 申请日期 1979.06.18
申请人 ULVAC CORP 发明人 NAKA KAZUHIKO
分类号 C23C14/34 主分类号 C23C14/34
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