| 摘要 |
Printed circuit boards are plated with a high acid-low copper sulfate bath which uses a grain refining agent comprising the extract of regular coffee added in an amount of between 0.1 and 1.0 g/l of bath solution. The bath is operated at a plating current density of between 15 and 60 asf and a bath temperature in the range of 20 DEG to 40 DEG C.
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