| 摘要 |
PURPOSE:To maintain a secure airtightness by absorbing thermal and mechanical stress with a cap, wherein a window frame type cap, having a ultraviolet rays transmission glass covering, is sealed by seam-welding on a frame body, which is an integration of a thin Kover plate and a thick Kover frame. CONSTITUTION:A semiconductor chip 2b of a ultraviolet rays eliminating type EPROM or the like is adhered to a ceramic substrate 1b. A seal frame 7b is soldered to the upper surrounding section of the bonding pad section 4b provided on the surface of the substrate 1b. A cap 8b for hermetical sealing is consisted of a formed cap 9b of a drawn Kover plate having a square hole in the center, a ultraviolet rays transmitting glass 10b and a Kover frame 11b for adhesion of glass. The Kover frame 11b of the cap is inserted to the seal frame 7b and sealed by seam- welding. As a result, the thermal and mechanical stress is sufficiently absorbed by the cap, so a plastic deformation does not occur to the Kover frame and a secure airtightness can be maintained. |
