| 摘要 |
PURPOSE:To strengthen the bonding force of plating films and improve a bonding property by a method wherein two layer electrodes (lower layers are of Cr and upper layers are of Au or Cu) connected to an exothermic element and a wear resisting layer are formed, and the upper layers of the electrodes and successively the lower layers are partially melted and plated. CONSTITUTION:SiTa used for an exothermic element and the layers of Cr in 0.2mu and Au or Cu in 0.6mu used for electrodes are successively made up on a glazed ceramic substrate by means of evaporation, and the exothermic element, whose one end is connected to a common electrode and whose another end is connected to separate electrodes, is formed by means of photoetching. An SiC film is made up so as to coat the exothermic element, steeped in a liquid (I2+KI, ferric chloride, etc.) dissolving Au or Cu, and steeped in a liquid (a mixed liquid of potassium ferricyanide and caustic soda, etc.) dissolving Cr (an oxide). The upper portions of the electrodes not coated with a wear resisting layer are plated. There is no Cr on the surfaces, there happen an Au-Sn eutectic reaction, etc. in case of bonding uniformly, and spherical Sn is not generated. |
