| 摘要 |
PURPOSE:To reduce the deterioration of a brazing material due to heat cycle and lengthen the lifetime of an automobile ignition device or the like, by dividing a metallized layer which is provided on an insulating plate whereon a semiconductor unit is mounted in the device, into a portion whereon the unit is mounted, another portion to which a wire is attached and still another portion for electrically connecting the former portions to each other. CONSTITUTION:A metallized layer for mounting a semiconductor unit 8 or the like is provided on only necessary surface regions of an insulating plate 1, namely, on a metallized surface region 2 which has almost the same size as the unit 8 and serves to secure the unit by a brazing material 7, a band-shaped metallized surface region 3 which serves to suppress the inclination of the insulating plate 1 and to which one end of a wire 9 is attached and another surface region 4 for electrically connecting the former surface regions 2, 3 to each other. The reverse side of the insulating plate 1 is bonded to a heat sink 5 by a brazing material 6. The electrodes of the unit 8 are connected by wires 11, 12 to the wiring sections of a printed circuit board 10 provided on the heat sink 5. |
