发明名称 SEMICONDUCTOR DEVICE SEALED UP WITH THIN RESIN
摘要 PURPOSE:To prevent warp and thickness change, by reducing the thickness of a thicker seal-up resin portion, which sandwiches a lead frame together with a thinner seal-up resin portion, toward the quadrilateral periphery of the thickner resin portion. CONSTITUTION:Seal-up resin 1 has a partial thickness t1 above a side of a lead frame 2 and another partial thickness t2 below the side. The total thickness of the resin is t3. The edges of the periphery of four corners of the upper quadrilateral seal-up resin portion, whose thickness t1 is larger than that t2 of the other portion, are flatly or roundly cut to reduce the thickness of the edge section of the upper seal-up resin portion. Although the thicker resin portion is rovided on the pellet mounting side of the lead frame and the thinner resin portion is provided on the other side, the mechanical strength does not fall. Since the thickness of the peripheral section of the resin is small, only little warp occurs.
申请公布号 JPS55165654(A) 申请公布日期 1980.12.24
申请号 JP19790074113 申请日期 1979.06.12
申请人 发明人
分类号 H01L23/28;H01L23/31 主分类号 H01L23/28
代理机构 代理人
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