| 摘要 |
PURPOSE:To prevent generation of breaking and cracks due to the bending of an outer leading-out lead for a metallic stem generated at the time of the selecting process of an optical semiconductor device, and to obviate the generation of defective airtightness due to generation of the breaking and the cracks in glass for an airtight terminal creeping up around the lead. CONSTITUTION:The inside diameter of the through-hole 104 of a metallic stem 1 is formed in 1.0mm on the inside of an optical semiconductor device and in 1.4mm on the outside, and the inside diameter on the outside is made larger than that on the inside, thus preventing the creeping-up of glass for an airtight terminal from the underside 12 of the metallic stem to a lower section by 0.2mm or more. Accordingly, even when an outer leading--out lead is bent, no breaking and crack is generated, thus generating no defective airtightness. |
