| 摘要 |
<p>PURPOSE:To prevent the occurrence of the chipping of a semiconductor chip by providing a semiconductor chip adsorbing portion made of a cemented carbide alloy block, a holding portion which is linked to this adsorbing portion to install it to a die bonder, and a suction air port passing through the center portions of the adsorbing portion and the holding portion. CONSTITUTION:For example, a holding portion 2 made of SUS 440 etc. to be installed to a die bonder is linked to a semiconductor chip adsorbing portion 1 made of a cemented carbide alloy including a tungsten carbide in a body, and a suction air pot 3 passes through the center portions of the adsorbing portion 1 and the holding portion 2, to form a collet. Thus, by changing the material of the holding portion 2, the ratio of the weight of the collet to the load applied to the semiconductor chip at the time of die bonding can be suppressed to 10-30%. Thereby, the occurrence of the chipping of the semiconductor chip at the time of die bonding can be restrained.</p> |
