| 摘要 |
PURPOSE:To prevent oozing of resin and eliminate adverse affect thereof in a lead frame of a resin molded semiconductor device by forming a groove for preventing oozing of resin in the vicinity of the air vent hole position of a molding frame. CONSTITUTION:A resin package body 2 is formed via upper and lower dies 5 and 6 at a lead frame 1. In this case, an oozing preventing groove 3 is formed on the outer frame of the lead frame 1 in the vicinity of an air vent hole 8 provided at opposite side to the resin filling port 7. |
