发明名称 CAPILLARY FOR WIRE BONDING DEVICE
摘要 <p>PURPOSE:To join a wire positively with a lead bonding section in a sufficient joining area, and to increase and stabilize the joining strength of the wire by setting the angle of the tip of a capillary within a specific range. CONSTITUTION:When a wire 2 is passed through a wire inserting hole 1a in a capillary 1 and the capillary 1 is lowered, the tip section of the capillary 1 is brought into contact with the surface of a lead bonding section 4 through the wire 2. When ultrasonic waves are applied to the capillary 1, micro- vibrations are generated in the capillarry 1, thus joining the wire 2 with the lead bonding section 4 at the tip section of the capillary 1. The angle theta of the tip of the capillary 1 extends over 2-4 deg. at that time, and is brought to not more than half the angle 8 deg. of a conventional tip. Accordingly, the joining area of the joining section of the wire 2 joined with the lead bonding section 4 by the capillary 1 at the angle theta of the tip of 2-4 deg. is made larger than that of a wire joining section by the capillary 1 at the angle 8 deg. of the tip.</p>
申请公布号 JPH01129429(A) 申请公布日期 1989.05.22
申请号 JP19870287503 申请日期 1987.11.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 URASAKI TAKAMI
分类号 B23K20/00;B23K20/10;H01L21/60 主分类号 B23K20/00
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