| 摘要 |
PURPOSE:To increase distortion absorbing effect by the method wherein a distortion absorbing through hole is provided on the joint between a tab for fastening a semiconductor chip and a tab lead for connecting this to an outer frame, and at the same time, the joints on both sides of the through hole are made symmetrical with respect to the center axis of the tab lead. CONSTITUTION:Tab leads 8 are made to project from the center of both sides of tab 5 for fastening IC chip 6. In parallel to these on both sides of leads 8, leads 4 for leading out electrodes are provided. In this lead frame so constructed, usually through holes 9 for absorbing distortion are provided at the parts where the ends of leads 8 come into contact with the outer frame of frame 2. In this device, these are not provided here. Instead, they are formed on the joints with tab 5, and at the same time, the joints on both sides of through holes 9 are made symmetrical with respect to the center axis of leads 8. By this, distortion absorbing effect is increased and no deviation occurs for the tab. |
