| 摘要 |
<p>PURPOSE:To simplify chip making and reduce working hours by the method wherein, when pn-junction elements formed and aligned on a semiconductor wafer are cut off from the wafer as chips, they are punched in chip forms by a press. CONSTITUTION:A plurality of PN-junction elements are formed and aligned on semiconductor wafer 1, and Mo plate 3 is fixed on each element by using wax 2. Next, each elememt together with Mo plate 3 is cut off and made into an individual pellet. At this time, pellets are made by punching instead of using a scribe. That is, upper press mold 4 having upper punching mold 5 and lower press mold 10 having lower punching mold 12 are placed opposite each other, and wafer 1 with Mo plate 3 down is inserted between these. Subsequently, upper part supporting rod 7 with an opening at its lower end provided corresponding to each element is placed on each element, and by expanding compression spring 8, each element is punched. Each punched element is put into supporting hole 12a provided on lower punching mold 12. By this pelleting is simplified.</p> |
