| 摘要 |
PURPOSE:To improve humidity resistance by the method wherein a grommet for pulling out an external lead is fitted on a part of a case, and resin sealing is operated, and at this time a part of the joining surface of the case and grommet is cut and a gap is provided, and this gas is also filled with resin. CONSTITUTION:Electronic component 2 of composite IC structure is mounted on ceramic substrate 1, lead terminal 3 is soldered, and the entire body is covered with silicone resin. Next, the back of substrate 1 is fixed inside aluminum case 5', whose upper end is open. Grommet 7' having takeout lead 6 is inserted into the opening provided on one wall of case 5'. Its end is connected to lead terminal 3. In this structure, the joining surface of grommet 7' and case 5' is cut, and thereby step 10' is provided on grommet 7' and step 10 on case 5' so as to form gap 9. This gap is also filled with resin 8. By this, the sealed distance becomes long and humidity resistance is increased. |
