| 摘要 |
PURPOSE:To prevent resin from cracking by the method wherein, the end parts of each side of the main four sides of a resin body sealing a semiconductor element, at least one place is beveled, and at least one lead for supporting the element fixing surface is taken out therefrom. CONSTITUTION:Semiconductor element 3 is mounted on semiconductor element fastening unit 1. These are surrounded by a resin body having radial leads. Next, semiconductor element fastening unit supporting lead 2a is pulled out from the end of each side of the four sides of fastening unit 1 and this is fixed to frame 8 placed outside of the resin body. At this time, at least one place of the ends of each side of the four sides is provided with bevel 7, from which at least one lead 2a is pulled out. In this structure, length l1 of the corner bevel is made larger than width l2 taken by the surface bevel, and thereby the strain applied on the resin body at the time of cutting lead 2a for shaping the product is made even and thereby the occurrence of cracks is prevented. |
