发明名称 |
Semiconductor device plastic jacket having first and second annular sheet metal strips with corrugated outer edges embedded in said plastic jacket |
摘要 |
A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.
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申请公布号 |
US4240099(A) |
申请公布日期 |
1980.12.16 |
申请号 |
US19790019607 |
申请日期 |
1979.03.12 |
申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BRANDT, JURGEN;HEROLD, LUDWIG;PIKORZ, WOLFGANG;SONNTAG, ALOIS |
分类号 |
H01L23/04;H01L23/051;(IPC1-7):H01L23/42;H01L23/44;H01L23/46 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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