发明名称 |
Apparatus for wire bonding |
摘要 |
A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool. |
申请公布号 |
US4239144(A) |
申请公布日期 |
1980.12.16 |
申请号 |
US19780963167 |
申请日期 |
1978.11.22 |
申请人 |
KULICKE AND SOFFA IND INC |
发明人 |
ELLES, RICHARD J;KULICKE, FREDERICK W JR;SADE, MOSHE E;SOFFA, ALBERT |
分类号 |
B23K20/00;H01L21/00;H01L21/60;(IPC1-7):B23K19/04 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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