| 摘要 |
PURPOSE:To prevent crack of sealing resin for the semiconductor device by forming a scattered recesses underneath a bed carrying a pellet. CONSTITUTION:Recesses 22a, 22b... are scattered underneath the bed 11 for carrying the pellet of a lead frame. The recess may be formed for example with a semi-spherical shape having a diameter of approx. 0.4-1mm.. The semiconductor pellet 12 is placed on the upper surface, and resin is sealed as designated by broken lines 15. The stress caused by the difference of shrinkage coefficient between the resin and the bed can be absorbed to the recess 23 and thus dispersed. Accordingly, even if it is abruptly cooled, no crack occurs at the resin sealed portion to obtain the secmiconductor device having high reliability. |
