| 摘要 |
PURPOSE:To obtain the captioned head superior in the diameter of minute orifices, the deviation from circularity and others by a method wherein wires in accord with the diameter of minute orifices are wound round the base material of a metal mold, further the wires in an electroforming layer are melted and removed by specific treatment, and, by using the layer as the metal mold, an electroforming master and then an electroforming film are formed. CONSTITUTION:The wires 5, such as copper wires, in accord with the diameter of desired minute orifices are wound round the base material 1 of a metal mold, being arranged in parallel. Next, an electroforming layer 6 is formed with the thickness allowing the wires 5 to be buried therein and, after the surface thereof being ground to be smooth, another base material 8 having the same quality with that of the base material 1 is fixed thereto, the ground surface 9 being formed in the direction perpendicular to that of wires 5. Then, after the wires 5 being melted and removed and a metal mold 11 with a concave part 10 being formed, thermoplastic resin 13 is heated and pressed, thereby a resin sheet 12 with projections 15 being formed. On the surface thereof a conductivity-treatment film 16 is formed as an electroforming master 17 and an electroforming film 18 is formed thereon. It is then exfoliated after lapping and thus a plate 20 having plural number of minute orifices 19 is formed. |
