| 摘要 |
<p>The circuit components (B) with interconnecting conductors (L) are applied to both surfaces of a substrate, for example by screen printing processes. Conductors (L) are brought from each component (B) to one edge of the substrate where they end in terminals (1-11;1'-11') for the upper (Fo) and lower (Fu) substrate surface. Where necessary, open link points (B1, B2, B3) may be included in the conductors. In this state the values of individual components, for example resistors and capacitors, can be measured and adjusted. After setting the correct component values the necessary links can be fitted (B1-B3) and the required interconnectors between upper and lower sides made by connecting terminals together (for example 4-4';8-8'). The circuit is now ready for final surface treatment and encapsulation. The proposed mfg. process makes improved use of the available substrate area, and can also assist in reducing mfrg. time.</p> |
