| 摘要 |
PURPOSE:To equalize illumination while increasing the accuracy of the movement of a bonding wire by a mechanism wherein a ring lens which has a measuring hole at a central portion and a slit extending to the measuring hole from an outer circumference is disposed to an upper portion of a bonding location, and the bonding locationis illuminated through the lens. CONSTITUTION:Bonding is performed in such a manner that an arm 6 with a capillary 5 to which a bonding wire 3 from a spool 4 is penetrated is advanced to an electrode of a semiconductor element 1 fastened onto a lead frame 2 from the lateral direction. Since it is necessary to illuminate the location at that time, the location is illuminated from an upper portion while the insertion of the capillary 5 is facilitated. That is, the location is illuminated by light from a light source 7 through a condensing lens 11, a reflector 12, central portion thereof has a measuring hole 13 for passing reflecting measuring light, and a ring lens 14 having similarly a measuring hole 15 and a slit 16 for the insertion of the wire 3 extending to the hole 15 from an outer circumference. Light reflected from the location is passed through the holes 15, 13 and enlarged by means of an expanding lens 9, and the location is measured by using a vidicon tube 10. |
