MULTILAYER WIRING SUBSTRATE,申请号JP19790067290-传众专利搜索

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发明名称	MULTILAYER WIRING SUBSTRATE
摘要
申请公布号	JPS55158697(A)	申请公布日期	1980.12.10
申请号	JP19790067290	申请日期	1979.05.30
申请人		发明人
分类号	H05K3/46	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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