发明名称 |
Polyimide coating process and material |
摘要 |
A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/leveling/flow control agent. A typical formulation comprises an aromatic polymer which cures to form a polyamide-imide polymer, an organic solvent or a mixture of orangic solvents and a non-ionic fluorocarbon surfactant. |
申请公布号 |
US4238528(A) |
申请公布日期 |
1980.12.09 |
申请号 |
US19790081298 |
申请日期 |
1979.10.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
ANGELO, RAYMOND W;POLIAK, RICHARD M;SUSKO, JOHN R |
分类号 |
H01B3/30;H01L21/312;H01L21/56;H01L23/29;H01L23/31;H05K3/28;(IPC1-7):H05K3/28 |
主分类号 |
H01B3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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