发明名称 LEAD FRAME FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To prevent displacement of a chip by forming a slightly larger recess than the chip at the center of an island. CONSTITUTION:A recess being slightly larger than a semiconductor chip 5 longitudinally and laterally and having infinitesimal size is formed at the center of an island 6. A gold plate 7 is coated on the recess, and molten at high temperature, and the semiconductor chip 5 is melt-stuck thereto.
申请公布号 JPS55157247(A) 申请公布日期 1980.12.06
申请号 JP19790065474 申请日期 1979.05.25
申请人 KYUSHU NIPPON ELECTRIC 发明人 INABA SEIJI
分类号 H01L21/52;H01L23/495;H01L23/50 主分类号 H01L21/52
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