| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a resin compsn. which is excellent in quick curability and flowability and gives a cured item having a low moisture absorption and an excellent resistance to solder crack by compounding a specific mixture of two epoxy resins, a specific phenol resin as an epoxy resin curative, an inorg. filler, and a cure accelerator. SOLUTION: This compsn. contains, as essential ingredients, a mixture comprising 50-95 pts.wt. novolak epoxy resin and 5-50 pts.wt. 4,4'-biphenol-type epoxy resin of formula I (wherein (m) is a mean value, being 0-0.5); a phenol resin of formula II as the epoxy resin curative; an inorg. filler in an amt. of 80-95 wt.% of the compsn.; and a cure accelerator. In formula II, each R is independently a 1-10C alkyl, a (substd.) phenyl, an alkoxy, or the like; each Z is independently a 1-15C divalent hydrocarbon group provided at least one Z in one molecule is a 5-15C divalent hydrocarbon group; (n) is a mean value, being 0-8; and each (i) is independently an integer of 0-3.</p> |
