发明名称 SWAGING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a swaging device which is capable of increasing the punch quantity of a die to realize the high working speed without increasing the size of a whole device or complicating its structure, and capable of simply interlocking the punch by the die with the release only by the positional relationship between a roll and the die. SOLUTION: In a swaging device 20 to bring dies 1, 2 into contact with a roll and to make the dies move to the center by rotating a shaft 10, or a roll 8 and a roll cage 9, a plurality of dies in which the effective punching area of the dies to a work is smaller than the effective contact area of the dies to the roll are arranged across each other on a die arrangement part, and a plurality of punching parts by the dies are provided.</p>
申请公布号 JP2000042677(A) 申请公布日期 2000.02.15
申请号 JP19980209750 申请日期 1998.07.24
申请人 YAZAKI CORP 发明人 KASUGA YASUTO;FUJINO TOSHIHIRO
分类号 B21J7/16;B21J9/06;B21J13/02;(IPC1-7):B21J7/16 主分类号 B21J7/16
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