发明名称 METHOD OF DIFFUSING B INTO SI WAFER
摘要 PURPOSE:To diffuse B to an optional medium or low concentration, by laminating a thin SiN film, a BN film and a thin SiN film by the CVD method over an Si substrate having an SiO2 film provided with an opening, and by effecting heat treatment. CONSTITUTION:An opening is made through an SiO2 film 2 on an Si substrate 1. The substrate is put in a reaction tube. The substrate and the film are treated with SiH4-NH3-N2 gas at about 850 deg.C to produce a thin SiN film 51. Subsequently, the gas is replaced with B2H6-NH3-N2 gas and the substrate and the film are treated at about 350 deg.C to make a BN film 4. The gas is replaced with SiH4-NH3-N2 gas again and the substrate and the films are treated at about 850 deg.C to laminate an SiN film 5. They are then treated with N2 gas at 1,200 deg.C to produce a B-diffused layer 6. According to this method, the SiN film grows with the lapse of treatment time to hinder B from being supplied from the BN film. Therefore, the B-diffused layer can be set at a desired surface concentration by controlling the thickness of the thin SiN film 51.
申请公布号 JPS55154730(A) 申请公布日期 1980.12.02
申请号 JP19790063042 申请日期 1979.05.22
申请人 FUJIKURA LTD 发明人 SHIYOUNO KATSUFUSA;GOSHIMA HIDEAKI;SHINMEN TOORU;HASHIMOTO HIROKAZU
分类号 H01L21/225;(IPC1-7):01L21/225 主分类号 H01L21/225
代理机构 代理人
主权项
地址