发明名称 HEATTSENSITIVE SWITCHING DEVICE
摘要 PURPOSE:To switch ON or OFF by temperature and DC power source in a heat- sensitive switching device by forming lateral and longitudinal pnpn thyristor in the same semiconductor substrate, connecting a load through an external power source and a diode to the lateral thyristor and controlling it with the longitudinal thyristor. CONSTITUTION:A p-type emitter region 4, a p-type base region 6 and an n-type emitter region 8 disposed therein are formed in a common n-type Si substrate 1 becoming the n-type base region 3 of the lateral thyristor A to form a lateral thyristor A. Then, a layer 2 becoming the n-type emitter region of longitudinal thyristor B is diffused and formed on the back surface of the substrate 1, and a p-type base region 6 is formed while contacting the thyristor A and n-type emitter region 8 and n-type base region 12, and a p-type emitter region 14 are formed in the region 3 disposed thereon to form a longitudinal thyristor B. In this manner, a load is connected through the external power source 23 and a diode 24 to the thyristor A, and the part of the circuit is connected to the region 14.
申请公布号 JPS55154764(A) 申请公布日期 1980.12.02
申请号 JP19790063412 申请日期 1979.05.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIHASHI YUTAKA;NAKADA YORISUKE
分类号 H01L35/00;H01L27/08;H01L29/66;H01L29/74 主分类号 H01L35/00
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