METHOD AND DEVICE FOR MANUFACTURING CRYSTAL VIBRATOR

摘要

PROBLEM TO BE SOLVED: To reduce the thickness of a crystal wafer with high accuracy in a short time by finely polishing the surface of the wafer by optical etching without requiring such a complicated cleaning and drying process that is required for chemical etching and, at the same time, to highly reliably mass- produce an extremely thin crystal vibrator having a high oscillation frequency from the crystal wafer at a high yield. SOLUTION: After a polished crystal wafer is machined to a prescribed thickness by projecting a laser beam upon the wafer (a), oscillation frequencies are measured at every minute section over the whole surface of the wafer by using many minute measuring electrodes arranged on a glass substrate in a grid and the thicknesses of the parts of the wafer thicker than a prescribed thickness are corrected by irradiating the laser beam upon the parts based on the measured results (b). After many electrodes having prescribed sizes are formed on the whole surface of the wafer at prescribed intervals (c), chip- like crystal vibrators are manufactured by dicing the wafer at every electrode section (d).