发明名称 MANUFACTURE OF THIN FILM PLANE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To relieve the stress generated in a thin film work body in the course of heat treatment by heat treating a thin film work body formed of amorphous material and formed in a designated shape to a supercooled liquid region and after cooling to room temperature, removing at least a part of a substrate to form a thin film plane structure. SOLUTION: A amorphous material, the material having the glass transition temperature ranging from 200 to 600 deg.C in a supercooled liquid region is adopted to make a thin film on a designated substrate, which is worked into a designated shape to form a thin film work body. The formed thin film work body is heat-treated to a supercooled liquid region. In this case, the heating and retaining time depends on the kind of constituting material, the thickness of the thin film and the forming condition, normally ranging from 0.5 to 5 min. Thus, the stress in the thin film work body can be sufficiently relieved. Subsequently, the thin film work body is cooled from the supercooled liquid region to the room temperature, and at least a part of the substrate is removed. The thickness of the thin film work body is not limited particularly, but can be formed into any thickness within a region having a supercooled liquid region according to uses.
申请公布号 JP2000317896(A) 申请公布日期 2000.11.21
申请号 JP19990126593 申请日期 1999.05.07
申请人 TOKYO INST OF TECHNOL 发明人 SHIMOKAWABE AKIRA;HATA SEIICHI
分类号 B81B3/00;B81C1/00;C23F1/00;H01L21/306;(IPC1-7):B81B3/00 主分类号 B81B3/00
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