发明名称 Encapulation process for mono-and polycrystalline silicon solar cell modules
摘要 A crystalline silicon based solar cell module comprising: (a) a crystalline silicon based solar cell array formed by interconnecting a plurality of crystalline silicon based solar cells with an interconnect; (b) a hot melt adhesive applied above and below the interconnect to reduce mechanical and thermal stress between the interconnect and the crystalline silicon based solar cells. The hot melt adhesive can be an ethylene-polymer along with a variety of additives such as oxidation inhibitor, UV stabilizer, and UV absorber.
申请公布号 US6166322(A) 申请公布日期 2000.12.26
申请号 US19990292873 申请日期 1999.04.16
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHEN, CHIH-CHIANG;PAN, JING-PIN
分类号 H01L31/048;H01L31/05;(IPC1-7):H01L31/048 主分类号 H01L31/048
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