| 摘要 |
PURPOSE:To avoid disconection by a method wherein an intermediate conductor of which conduction mechanizm is same as a pellet is attached on a conductive film on which a package is to be fixed and a conductive film is provided on its surface and it is connected with an external terminal utilizing a lead wire which is composed of same material as the conductive film. CONSTITUTION:On a conductive film 17 on which a package is to be fixed, a semiconductor pellet 13 and an intermediate conductor 20 made of a low resistance wafer of which conduction mechanizm is same as the semiconductor are fixed, and it is connected with an external terminal 12a by an Al lead wire 19a. By this method an intermetallic compound can not be produced in spite of high temperature by which connection of the Al lead wire or glass sealing is performed, and connection without any disconnecting fault but with high reliability is obtained. |
