| 摘要 |
PURPOSE:To improve a dampproof property when making a resin sealed semiconductor device by moulding and hardening an epoxy resin component substance by specifying an epoxy resin, a hardener and a hardening accelerator to be composed of. CONSTITUTION:When moulding a semiconductor device using an epoxy resin composed substance, a cresol novolak type epoxy resin with an oxirane ring of more than two in a molecule is used. Also as a hardener to be mixed with the above, phthalic anhydride and novolak resin or the like are used, and as a hardener, silane coupling agent is used. At this time, as for the coupling agent among these mixing agents, within the limits of 0.01-5 parts of silane coupling agent having melcaptan radical is mixed with coupling agent against 100 parts of epoxy resin. The moisture absorption factor exceeds 1% ordinarily, but it will be decreased to below 1% with the method above-mentioned, thereby producing a high dampproof property. |
