| 摘要 |
PURPOSE:To eliminate the occurrence of defective elements caused by static electicity when performing the prescribed printing with a resin package placed on a semiconductor device on a shoot rail using a letter transferring roller by having a composition in which a lead protruding from the package is grounded to the rail. CONSTITUTION:A protruding section sandwiched between groove is provided on the surface of a grounded shout rail 21 along with the longitudinal direction, and on the top of the protruded section a groove 22, where a package 13 sealed with epoxy resin or the like will be positioned, is formed. On this groove 22 the package 13 is placed, the protruding lead 15 is bent and contacted to the walls on both sides of the protruded section, and they are held in the grounded condition. Also a guide material 24 is provided on the edges of both ends of the rail 21 using a bolt 25, and with the above guide material 24 used as a guide the prescribed printing is performed by operating a letter transferring roller 12 consisted of a shaft 18 and a nut 19 on the surface of the package 13 and having an acrylonitrile rubber on the surface of circumference. Upon accomplishment of the methods above mentioned, there remains no static electricity on the printing surface and will cause no defective elements as well. |
