发明名称 IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an image pickup device at a low cost that can easily be miniaturized and facilitate heat dissipation of an image pickup element even in the case of flange-back adjustment. SOLUTION: The image pickup device is provided with cases 2, 3 having openings 2a, 3a in one side, an image pickup element 12 that is contained in the cases and applies photoelectric conversion to a light made incident externally through the openings to photograph an object, and a heat transfer plate 11 that is placed in the vicinity of the image pickup element 12 in the cases and delivers the heat from the image pickup element to the cases 2, 3. Contact pieces 11d, 11e of the heat transfer plate 11 are in contact with the inner face of the cases through elastic deformation. In the case of making the heat transfer plate 11 by a non-elastic material, an elastically deformable heat transfer plate such as a heat transfer rubber is interposed between the heat transfer plate and the cases.
申请公布号 JP2001326840(A) 申请公布日期 2001.11.22
申请号 JP20000149800 申请日期 2000.05.17
申请人 SONY CORP 发明人 HONDA MICHITOKU
分类号 G03B19/02;G03B17/02;G03B17/55;H04N5/225;H04N5/335;H04N5/357;H04N5/372;(IPC1-7):H04N5/225 主分类号 G03B19/02
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