| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition which is excellent in adhesiveness with various members including semiconductor elements and lead frames, in soldering resistance upon substrate-packaging, and particularly in adherence with preplating frames of Ni, Ni-Pd, Ni-Pd-Au and the like. SOLUTION: The semiconductor-sealing epoxy resin composition essentially comprises (A) an epoxy resin, (B) a phenolic resin, (C) a compound represented by formula (1) and/or a hydrolyzate of a compound represented by formula (1), (D) an inorganic filler, and (E) a curing accelerator.
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