Multi-stud thermal conduction module

摘要

The thermal conduction module for removing heat from one or more chips located therein consists of a housing made of heat conductive materials forming a cap over the chips. The housing contains one or more openings, one opposite each of the chips. More than one heat conductive element is included in each of the openings and are free to move lengthwise within the opening. The heat conductive elements are spring loaded so that the end of each element contacts the associated chip thereby lowering the thermal resistance of the interface therebetween. Side spring means are located between the sides of adjacent heat conductive elements forcing them away from one another and into contact with the opening wall.