| 摘要 |
PURPOSE:To enhance the efficiently of mounting work of a semiconductor pellet by adhering a transparent adhesive sheet to the mounting side of a pellet element and bringing the mounting tool through the sheet into contact with the pellet to mount it on a substrate to be mounted. CONSTITUTION:The transparent adhesive sheet 11 is adhered onto the mounting surface or side of a semiconductor pellet S. The sheet 11 is retained in expanded state with the pellet on a substrate 13 to be mounted, positioned at the substrate 13 coated with liquid adhesive 14 having conductivity, the sheet 13 is attracted and secured with the mounting tool 12 having vacuum attracting function to be pressed onto the substrate 13. Subsequently, when the tool 12 is pulled up, the pellet S is mounted thereon. In this manner, the sheet 11 is transparent, and can be casily positioned to be exactly mounted thereon. |
