发明名称 |
Semiconductor device assembled into a chip size package |
摘要 |
A first insulating film has a first planar surface as a lower surface. A first semiconductor chip is disposed on the first insulating film. A second insulating film is disposed on the first semiconductor chip and the first insulating film and has a second planar surface as an upper surface. A first wiring layer is disposed under the first planar surface. A second wiring layer is disposed on the second planar surface and electrically connected to the first semiconductor chip. A first conductive column penetrates the first insulating film and the second insulating film. A conductor penetrates the second insulating film.
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申请公布号 |
US2004183192(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20040752019 |
申请日期 |
2004.01.07 |
申请人 |
OTSUKA MASASHI;TAKUBO CHIAKI |
发明人 |
OTSUKA MASASHI;TAKUBO CHIAKI |
分类号 |
H01L23/12;H01L23/31;H01L23/538;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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