发明名称 |
Assembly of semiconductor device, interposer and substrate |
摘要 |
An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.
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申请公布号 |
US2004184219(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20040801867 |
申请日期 |
2004.03.17 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
OTSUKA JUN;SATO MANABU;ITO JUNICHI;HAYASHI KAZUHIRO;SATO MOTOHIKO |
分类号 |
H01L21/60;H01L23/498;H01L23/50;H05K1/02;H05K1/14;H05K1/18;(IPC1-7):H01G4/228 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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