发明名称 |
Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods |
摘要 |
A capacitive structure is made with thin film capacitor plates substantially surrounding an opening cavity for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array (BGA) having a flip chip in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.
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申请公布号 |
US6806568(B2) |
申请公布日期 |
2004.10.19 |
申请号 |
US20010908751 |
申请日期 |
2001.07.20 |
申请人 |
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS |
发明人 |
SCHAPER LEONARD W. |
分类号 |
H01L23/36;H01L23/50;H01L23/64;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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