| 发明名称 |
Chip-scale packages stacked on folded interconnector for vertical assembly on substrates |
| 摘要 |
A vertical stack of semiconductor devices 140, 141 is formed by folding a strip-like flexible interconnector 101 assembled with integrated circuit chips 130, 133, packages and/or passive components and attaching coupling members 107 solderable to other parts. <IMAGE> |
| 申请公布号 |
EP1306900(A3) |
申请公布日期 |
2005.07.06 |
| 申请号 |
EP20010000785 |
申请日期 |
2001.12.20 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MORRISON, GARY P.;EDWARDS, DARVIN R.;STARK, LESLIE |
| 分类号 |
H01L25/18;H01L23/31;H01L23/48;H01L23/538;H01L25/10;H01L25/11;H05K1/18 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
