| 摘要 |
PURPOSE:To confirm the multi-needle probe base plate by overlaying the second prove base plate on which a defectless semiconductor device is mounted, to a testing probe base plate which has electrical connections with it. CONSTITUTION:On the first probe base plate 1, a plural number of probe needles 2 are arranged to be correspondent with each electrode on a semiconductor device, and a plural number of terminals 5 which are arranged electrical connections with each probe needle 2 and in the same way with electrodes 4 of the base plate. On the second plate 6 a socket 8 on which a defectless sample is to be inserted is provided, and each electrode on the socket 8 is connected with terminals 7 which are disposed arround the socket 8. A defectless sample is inserted into the socket 8, and with terminals 5 of the probe base plate 1 connected with terminals 7 of the probe base plate 6, a multi-needle probe base plate is confirmed with ease. |
