| 摘要 |
PURPOSE:To prevent the thermal deterioration of a semiconductor element by disposing a glass case at upper position and a Dumet wire at lower position and the semicondutor element above a heater when sealing the glass case for mounting the Dumet wire wound with beads and the element such as a miniature glass diode or the like. CONSTITUTION:A glass case 4 in which a semiconductor element 1 such as a diode is secured with solder piece 2 to a header 3, is placed from above in downward direction, and a probe lead wire 7 made of Dumet wire wound with bead 8 to be externally led out is associated from below in upward direction therewith, and set in a carbon heater 10. The glass case is set into the carbon heater in the depth to the portion to be fused and bonded with the bead 8 of the probe lead wire, and the semiconductor element is disposed above the upper surface of the heater. In this manner, the semiconductor element is prevented from being deteriorated by the heat of the heater. Since the elements can be set in large quantity at the carbon heater, a large number of the elements can be simultaneously sealed. |
