| 摘要 |
<p>PURPOSE:To complete the grounding of a microwave integrated circuit device and reduce the size of the device by mounting a dielectric substrate forming a microwave integrated circuit at a conductive base, forming a hole corresponding to the opposite side surface thereto at a case and screwing a screw into the hole and a threaded hole to fix the conductive base to the case. CONSTITUTION:Threaded holes 6, 6 are formed on the opposite side surface of a surface at which a dielectric substrate 1 is mounted at a conductive base 2, and holes 7, 7 corresponding to the holes 6, 6, respectively are perforated at the bottom of the case 5. Screws 4 are screwed from the bottom of the case 5 through the upper holes 7, 7 and the holes 6, 6 to fixe the base 2 to the case 5. Then, input and output terminals 8, 9 are provided thereat. Accordingly, the base 2 has the same size as the substrate 1, and the case 5 has the same opening area as the substrate 1 to be thus reduced in size. Further, there is freedome in the position for forming the holes 6, 6, and the base 2 can be exactly secured to the case 5 without bending it by selecting the number of the holes 6, 6 so as to complete the grounding of the case of the microwave integrated circuit.</p> |
