| 摘要 |
<p>PURPOSE:To improve adhesion between layers, moisture resistance and chemical resistance of a multilayer board, by laying prepregs prepared by coating a substrate with a specific curable resin composition, upon a copper-clad laminate for multilayer boards, prepared by cleaning the internal copper foil surface and treating them with a specific aqueous solution; and molding the resulting laminated board. CONSTITUTION:The internal curcuit copper foil surfaces of a two-side copper-clad laminate for multilayer boards are cleaned physically or chemically (for example, with an aqueous solution of CuCl2 and HCl) and the surfaces are treated with a mixed solution of NaOH and a peroxosulfate such as K2S2O8. Upon each side of the two-side copper-clad laminate thus treated, is laid a one-side copper-clad laminate prepared by using a B-stage prepreg prepared by impregnating glass cloth with a curable resin composition containing a prepolymer obtained by reacting 2,2- bis(4-cyanatophenyl)propane, etc., with bis(4-maleimidophenyl)-methane, etc., optionally combined or prereacted with a novolak epoxy resin, etc, and drying the impregnated product. The resulting product is laminate-molded to obtain a multilayer board. Thereby, heat resistance, electrical properties, haloresistance and smear resistance are also improved.</p> |
