发明名称 Surface treating apparatus
摘要 A surface treating process according to the present invention, a vapor deposited film is formed from an easily oxidizable vapor-depositing material on the surface of a work by evaporating the vapor-depositing material in a state in which the vapor deposition controlling gas has been supplied to at least zones near a melting/evaporating source and the work within a treating chamber. Thus, the vapor deposited film can be formed stably on the surface of a desired work without requirement of a long time for providing a high degree of vacuum and without use of a special apparatus. In addition, the use of the surface treating process ensures that a corrosion resistance can be provided to a rare earth metal-based permanent magnet extremely liable to be oxidized, without degradation of a high magnetic characteristic of the magnet. A surface treating apparatus according to the present invention includes a melting/evaporating source for melting and evaporating a wire-shaped vapor-depositing material containing a vapor deposition controlling gas, and a member for retaining a work on which the vapor-depositing material is deposited. The melting/evaporating source and the work retaining member are disposed in a treating chamber of the surface treating chamber. The apparatus further includes a vapor-depositing material supply means for supplying the wire-shaped vapor-depositing material containing the vapor deposition controlling gas to the melting-evaporating source.
申请公布号 US7270714(B2) 申请公布日期 2007.09.18
申请号 US20030615381 申请日期 2003.07.09
申请人 SUMITOMO SPECIAL METALS CO., LTD. 发明人 NISHIUCHI TAKESHI;TOCHISHITA YOSHIMI;KIKUI FUMIAKI;KIZAWA MITSUO
分类号 C23C14/24;C23C14/16;C23C14/22;C23C14/50;H01F7/02;H01F41/02 主分类号 C23C14/24
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